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3D stencils – simultaneous printing on multiple levels

This newly developed process for SMD stencils differs from normal step technology. 3D technology is used to facilitate simultaneous printing on several levels of a substrate, or to compensate for elevations or recesses on the substrate.


We have developed special squeegees for this 3D technology that follow the stencil surface during printing.

Technical information

  • Stencil thickness of base material: 75 µm up to 2000 µm
  • Ascending and descending steps are possible on both sides.
  • Step technology offers a number of options for special applications.

Christian Koenen KFT
HighTech Stencils

9027 Győr, Ipari Park
Égerfa u. 9

T +36 96 511 470
F +36 96 511 479


© 2022 Christian Koenen KFT.